Fabrication of field effect transistors with different threshold voltages through modified channel interfaces

ABSTRACT

A method of fabricating a plurality of field effect transistors with different threshold voltages, including forming a cover layer on a channel region in a first subset, forming a first sacrificial layer on two or more channel regions in a second subset, forming a second sacrificial layer on one of the two or more channel regions in the second subset, removing the cover layer from the channel region in the first subset, forming a first dummy dielectric layer on the channel region in the first subset, and forming a second dummy dielectric layer on the first dummy dielectric layer and the first sacrificial layer on the channel region in the second subset.

BACKGROUND Technical Field

The present invention generally relates to the fabrication of multiplefin field effect transistors (FinFETs) having different thresholdvoltages by modifying the FinFETs' channel interfaces, and moreparticularly to modifying the germanium concentration of the devicechannels at the interface of the vertical fins with a sacrificialstructure.

Description of the Related Art

A Field Effect Transistor (FET) typically has a source, a channel, and adrain, where current flows from the source to the drain, and a gate thatcontrols the flow of current through the channel. Field EffectTransistors (FETs) can have a variety of different structures, forexample, FETs have been fabricated with the source, channel, and drainformed in the substrate material itself, where the current flowshorizontally (i.e., in the plane of the substrate), and FinFETs havebeen formed with the channel extending outward from the substrate, butwhere the current also flows horizontally from a source to a drain. Thechannel for the FinFET can be an upright slab of thin approximatelyrectangular Si, commonly referred to as the fin with a gate on the fin,as compared to a metal-oxide-semiconductor field effect transistor(MOSFET) with a gate parallel with the plane of the substrate.

Depending on the doping of the source and drain, an n-type FET (NFET) ora p-type FET (PFET) can be formed. An NFET and a PFET can be coupled toform a complementary metal oxide semiconductor (CMOS) device, where ap-channel MOSFET and n-channel MOSFET are coupled together.

With ever decreasing device dimensions, forming the individualcomponents and electrical contacts becomes more difficult. An approachis therefore needed that retains the positive aspects of traditional FETstructures, while overcoming the scaling issues created by formingsmaller device components, including channel lengths and gate dielectricthicknesses.

SUMMARY

In accordance with an embodiment of the present invention, a method offabricating a plurality of field effect transistors with differentthreshold voltages is provided. The method includes forming a coverlayer on a channel region in a first subset, forming a first sacrificiallayer on two or more channel regions in a second subset, forming asecond sacrificial layer on one of the two or more channel regions inthe second subset, removing the cover layer from the channel region inthe first subset, forming a first dummy dielectric layer on the channelregion in the first subset, and forming a second dummy dielectric layeron the first dummy dielectric layer and the first sacrificial layer onthe channel region in the second subset.

In accordance with another embodiment of the present invention, a methodof fabricating a plurality of field effect transistors with differentthreshold voltages is provided. The method includes forming a firstsacrificial layer on two or more channel regions in a second subset,wherein the first sacrificial layer is silicon-germanium oxide (SiGeO),forming a second sacrificial layer on one of the two or more channelregions in the second subset, wherein the second sacrificial layer issilicon-germanium oxide (SiGeO), removing the cover layer from thechannel region in the first subset, forming a first dummy dielectriclayer on the channel region in the first subset, and forming a seconddummy dielectric layer on the first dummy dielectric layer and the firstsacrificial layer on the channel region in the second subset.

In accordance with yet another embodiment of the present invention, aplurality of field effect transistors with different threshold voltagesis provided. The plurality of field effect transistors with differentthreshold voltages includes a channel region in a first subset, two ormore channel regions in a second subset, a modified interfacial regionon the two or more channel regions in the second subset, and a gatedielectric layer on the channel region in the first subset.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following description will provide details of preferred embodimentswith reference to the following figures wherein:

FIG. 1 is a cross-sectional view showing a plurality of vertical fins ona substrate, in accordance with an embodiment of the present invention;

FIG. 2 is a cross-sectional view showing a first cover layer on aportion of the substrate and a first subset of the vertical fins, inaccordance with an embodiment of the present invention;

FIG. 3 is a cross-sectional view showing a first sacrificial layer on aportion of the substrate and a second subset of the vertical fins notmasked by the cover layer, in accordance with an embodiment of thepresent invention;

FIG. 4 is a cross-sectional view showing an unmasked vertical fin and asecond cover layer on a vertical fin of the second subset, in accordancewith an embodiment of the present invention;

FIG. 5 is a cross-sectional view showing a second sacrificial layer onthe first sacrificial layer, in accordance with an embodiment of thepresent invention;

FIG. 6 is a cross-sectional view showing a first dummy dielectric layeron the vertical fins of the first subset after removal of the firstcover layer, in accordance with an embodiment of the present invention;

FIG. 7 is a cross-sectional view showing a second dummy dielectric layeron the first dummy dielectric layer and the first sacrificial layer, andenlarged views of the sacrificial layers and dummy dielectric layers onthe vertical fins, in accordance with an embodiment of the presentinvention;

FIG. 8 is a cross-sectional view showing a fill layer on the seconddummy dielectric layer and second sacrificial layer, in accordance withan embodiment of the present invention;

FIG. 9 is a cross-sectional view showing a heat treatment of thevertical fins, sacrificial layers and dummy dielectric layers, inaccordance with an embodiment of the present invention;

FIG. 10 is a cross-sectional view showing a silicon-enriched interfaceregion on the second subset of vertical fins, and enlarged views of themodified sacrificial layer and modified dummy dielectric layer on thevertical fins, in accordance with an embodiment of the presentinvention;

FIG. 11 is a cross-sectional view showing a silicon-enriched interfaceregion on the second subset of vertical fins, gate structures on thevertical fins, and enlarged views of the layers on the vertical fins, inaccordance with an embodiment of the present invention;

FIG. 12 is a cross-sectional view showing gate structures and topsource/drains on the vertical fins, in accordance with an embodiment ofthe present invention;

FIG. 13 is a cross-sectional view showing a cover layer and asacrificial layer on a substrate, in accordance with an embodiment ofthe present invention;

FIG. 14 is a cross-sectional view showing a cover layer on the firstsacrificial layer and the substrate, and an exposed portion of the firstsacrificial layer, in accordance with an embodiment of the presentinvention;

FIG. 15 is a cross-sectional view showing a second sacrificial layer onthe exposed portion of the first sacrificial layer, in accordance withan embodiment of the present invention;

FIG. 16 is a cross-sectional view showing an exposed portion of thesubstrate, in accordance with an embodiment of the present invention;

FIG. 17 is a cross-sectional view showing a first dummy dielectric layeron the substrate, and a cover layer on the first and second sacrificiallayers, in accordance with an embodiment of the present invention;

FIG. 18 is a cross-sectional view showing a fill layer on the dummydielectric layers and sacrificial layers, in accordance with anembodiment of the present invention;

FIG. 19 is a cross-sectional view showing heat treatment of the filllayer, dummy dielectric layers and sacrificial layers, in accordancewith an embodiment of the present invention;

FIG. 20 is a cross-sectional view showing gate structures on channelregions in the substrate, and enlarged views of the layers on thechannel regions, in accordance with an embodiment of the presentinvention;

FIG. 21 is an X-ray photoelectron spectroscopy plot for germaniumshowing the change in chemical composition and environment by heattreatment, in accordance with an embodiment of the present invention;

FIG. 22 is an X-ray photoelectron spectroscopy plot for silicon showingthe change in chemical composition and environment by heat treatment, inaccordance with an embodiment of the present invention;

FIG. 23 is an X-ray photoelectron spectroscopy plot for germaniumshowing the change in chemical composition and environment by heattreatment, in accordance with an embodiment of the present invention;

FIG. 24 is an X-ray photoelectron spectroscopy plot for silicon showingthe change in chemical composition and environment by heat treatment, inaccordance with an embodiment of the present invention; and

FIG. 25 is a block/flow diagram of a fabrication process for formingmodified channel interfaces, in accordance with an embodiment of thepresent invention.

DETAILED DESCRIPTION

Embodiments of the present invention relate generally to obtainingdifferent threshold voltages for field effect devices by modifying aninterface region of the device channels. The interface regions ofsilicon-germanium channels can have differing amounts of germaniumgenerated by elimination reactions of a dummy silicon-germanium oxide(SiGeO) layer.

Embodiments of the present invention relate generally to heat treating asacrificial layer including silicon-germanium oxide (SiGeO) to migrategermanium from the channel region towards the channel interface andreduce the trap density at the interface of the SiGe channel and theoverlying SiO₂ dielectric layer by eliminating GeO.

Embodiments of the present invention relate generally to forming asilicon rich interfacial region on the channel regions of differentfield effect devices to vary the threshold voltages.

Exemplary applications/uses to which the present invention can beapplied include, but are not limited to: logic devices and memorydevices.

Referring now to the drawings in which like numerals represent the sameor similar elements and initially to FIG. 1, a plurality of verticalfins on a substrate is shown, in accordance with an embodiment of thepresent invention.

In one or more embodiments, a plurality of vertical fins 111 can beformed on a substrate 110, where the vertical fins 111 can be formed byan etching process into the substrate or an epitaxial growth process onthe substrate. The vertical fin can form a channel region of a fin fieldeffect transistor (FinFET).

The substrate 110 can be a semiconductor or an insulator with an activesurface semiconductor layer. The substrate can include a carrier layerthat provides mechanical support for other layers of the substrate. Thesubstrate 110 can include crystalline, semi-crystalline,microcrystalline, or amorphous regions. The substrate 110 can be asilicon wafer. In various embodiments, the substrate can be a singlecrystal silicon (Si) or silicon germanium (SiGe) wafer, or have a singlecrystal silicon (Si) or silicon germanium (SiGe) surface/active layer.

In various embodiments, a plurality of vertical fins 111 can be formedby a sidewall image transfer (SIT) process, self-aligned doublepatterning (SADP) process, or self-aligned quadruple patterning (SAQP)process, to provide a tight pitch between vertical fins 111. In variousembodiments, a direct print can be used to provide fin templates from afin template layer. Immersion Lithography can direct print down to about78 nm pitch. Extreme ultraviolet lithography (also known as EUV orEUVL), considered a next-generation lithography technology using anextreme ultraviolet (EUV) wavelength, can direct print down to a pitchsmaller than 50 nm. Self-aligned double patterning (SADP) can achievedown to about 40 nm to 60 nm fin pitch. Self-aligned quadruplepatterning (SAQP) may be used to go down to below 40 nm fin pitch. Whilethe figures illustrate a sidewall image transfer (SIT) process, this isfor descriptive purposes, since these other processes are alsocontemplated, and the scope of the claims and invention should not belimited to the particular illustrated features.

In various embodiments, the vertical fins 111 can be silicon-germanium(SiGe), where the germanium concentration can be in the range of about20 at. % (atomic percent) to about 75 at. %. The substrate 110 can alsobe silicon-germanium (SiGe), where the germanium concentration can be inthe range of about 20 at. % to about 75 at. %.

FIG. 2 is a cross-sectional view showing a first cover layer on aportion of the substrate and a first subset of the vertical fins, inaccordance with an embodiment of the present invention.

In one or more embodiments, a cover layer 120 can be formed on thesubstrate 110 and vertical fins 111, where the cover layer can be formedby a blanket deposition. A portion of the cover layer 120 can be removedto expose a second subset of vertical fins 111 on a second region 102 ofthe substrate, while a first subset of the vertical fins 111 remainsmasked on a first region 101 of the substrate 110. The cover layer 120can be a hardmask, for example, a flowable oxide (FOX) or a siliconnitride (SiN). The portion of the cover layer 120 can be removed usinglithography and etching processes.

FIG. 3 is a cross-sectional view showing a first sacrificial layer on aportion of the substrate and a second subset of the vertical fins notmasked by the cover layer, in accordance with an embodiment of thepresent invention.

In one or more embodiments, a first sacrificial layer 130 can be formedon the exposed vertical fins 111, where the first sacrificial layer 130can be formed by atomic layer deposition (ALD), plasma enhanced atomiclayer deposition (PEALD), chemical vapor deposition (CVD), plasmaenhance chemical vapor deposition (PECVD), or combinations thereof. Thefirst sacrificial layer 130 can be a silicon-germanium oxide (SiGeO),where the germanium concentration is in the range of about 10 at. %(atomic percent) to about 65 at. %, or in the range of in the range ofabout 20 at. % to about 75 at. %, or in the range of in the range ofabout 20 at. % to about 65 at. %.

The first sacrificial layer 130 can have a thickness in the range ofabout 1 nm to about 4.5 nm, or in the range of about 1 nm to about 2 nm.

FIG. 4 is a cross-sectional view showing an unmasked vertical fin and asecond cover layer on a vertical fin of the second subset, in accordancewith an embodiment of the present invention.

In one or more embodiments, a second cover layer 125 can be formed on avertical fin in the second subset, where the second cover layer 125 canbe formed on the first sacrificial layer 130. The second cover layer 125can be blanket deposited and a portion of the second cover layer 125removed to expose a vertical fin 111 of the second subset. The portionof the second cover layer 125 can be removed by a directional etch, forexample, a reactive ion etch (RIE).

FIG. 5 is a cross-sectional view showing a second sacrificial layer onthe first sacrificial layer, in accordance with an embodiment of thepresent invention.

In one or more embodiments, a second sacrificial layer 140 can be formedon the exposed portion of the first sacrificial layer 130. The secondsacrificial layer 140 can be formed by ALD, PEALD, CVD, PECVD orcombinations thereof. The second sacrificial layer 140 can besilicon-germanium oxide (SiGeO), where the second sacrificial layer 140can have the same germanium concentration as the first sacrificial layer130 or a different germanium concentration from the first sacrificiallayer 130. The second sacrificial layer 140 can have a germaniumconcentration in the range of about 10 at. % to about 65 at. %, or inthe range of in the range of about 20 at. % to about 75 at. %, or in therange of in the range of about 20 at. % to about 65 at. %.

The second sacrificial layer 140 can have a thickness in the range ofabout 1 nm to about 4.5 nm, or in the range of about 1 nm to about 2 nm.The combined thickness of the second sacrificial layer 140 and the firstsacrificial layer 130 can be in the range of about 4 nm to about 5 nm.

FIG. 6 is a cross-sectional view showing a first dummy dielectric layeron the vertical fins of the first subset after removal of the firstcover layer, in accordance with an embodiment of the present invention.

In one or more embodiments, a third cover layer 128 can be formed on theexposed second sacrificial layer 140 on the vertical fin 111 in thesecond subset. The third cover layer 128 can fill in the gap between thefirst cover layer 120 and the second cover layer 125, wherein the thirdcover layer 128 adjoins the second cover layer 125, and the adjacentvertical fins 111 in the second subset are masked by a cover layer 125,128. The first cover layer 120 can be removed by a lithography andetching process. The vertical fins 111 in the first subset can beexposed by the removal of the first cover layer 120.

In one or more embodiments, a first dummy dielectric layer 150 can beformed on the vertical fins 111 in the first subset exposed by removalof the first cover layer 120. The first dummy dielectric layer 150 canbe formed by atomic layer deposition (ALD) or plasma enhanced atomiclayer deposition (PEALD) to conformally cover the vertical fins. Thefirst dummy dielectric layer 150 can be silicon dioxide (SiO₂).

FIG. 7 is a cross-sectional view showing a second dummy dielectric layeron the first dummy dielectric layer and the first sacrificial layer, andenlarged views of the sacrificial layers and dummy dielectric layers onthe vertical fins, in accordance with an embodiment of the presentinvention.

In one or more embodiments, the second cover layer 125 can be removedfrom a vertical fin 111 in the second subset, where the second coverlayer 125 can be removed by a selective masking and etching. The firstsacrificial layer 130 on the vertical fin 111 can be exposed by removalof the second cover layer 125, while the second sacrificial layer 140 onanother vertical fin in the second subset can remain covered by thethird cover layer 128.

In one or more embodiments, a second dummy dielectric layer 160 can beformed on the first dummy dielectric layer 150 on the vertical fins 111in the first subset and on the exposed first sacrificial layer 130 onthe vertical fin 111 in the second subset. The second dummy dielectriclayer 160 can be formed by a conformal deposition (e.g., ALD, PEALD).The second dummy dielectric layer 160 can be silicon dioxide (SiO₂).

The enlarged views show the combined thicknesses of the sacrificiallayers 130, 140 and dummy dielectric layers 150, 160 on the substrate110 and vertical fins 111 in the first subset and the second subset. Thefirst dummy dielectric layer 150 and second dummy dielectric layer 160can have a thickness, W₁, in the range of about 4 nm to about 5 nm. Thefirst sacrificial layer 130 and second dummy dielectric layer 160 canhave a thickness, W₃, in the range of about 4 nm to about 5 nm. Thefirst sacrificial layer 130 and second sacrificial layer 140 can have athickness, W₂, in the range of about 4 nm to about 5 nm. Thethicknesses, W₁, W₂, and W₃ can be about the same on each vertical fin111.

FIG. 8 is a cross-sectional view showing a fill layer on the seconddummy dielectric layer and second sacrificial layer, in accordance withan embodiment of the present invention.

In one or more embodiments, the third cover layer 128 can be removed toexpose the second sacrificial layer 140 on the vertical fin 111 in thesecond subset. A fill layer 170 can be formed on the vertical fins 111and the substrate 110, where the fill layer 170 can be blanket depositedto fill in the spaces between the adjacent vertical fins. The fill layer170 can be formed over the top surfaces of the second dummy dielectriclayer 160 and second sacrificial layer 140 and a chemical-mechanicalpolishing (CMP) used to remove excess material and expose the topsurfaces of the second dummy dielectric layer 160 and second sacrificiallayer 140. The fill layer 170 can be amorphous silicon (a-Si).

FIG. 9 is a cross-sectional view showing a heat treatment of thevertical fins, sacrificial layers and dummy dielectric layers, inaccordance with an embodiment of the present invention.

In one or more embodiments, a heat treatment can be used to react thesubstrate 110, sacrificial layers 130, 140, and dummy dielectric layers150, 160. The heat treatment can cause germanium (Ge) and oxygen (O) todiffuse between the layers to form silicon dioxide (SiO₂) and germaniumoxide (GeO), where the volatile germanium oxide can diffuse away fromthe interface regions of the sacrificial layers 130, 140 with thevertical fins 111 and substrate 110.

In various embodiments, the heat treatment can be at a temperature inthe range of about 850° C. to about 1250° C., or in the range of about1000° C. to about 1100° C., or in the range of about 1050° C. to about1200° C., where a higher Ge percentage can utilize a lower temperaturerange to initiate the reaction and diffusion to form a modifiedinterfacial region. The heat treatment can be conducted for a period ofabout 1 second to about 60 seconds, where the heat treatment can be aflash anneal, a rapid thermal anneal (RTA), or a furnace anneal. Thevolatile GeO can leave the semiconductor material, while leaving siliconat the modified interfacial region.

FIG. 10 is a cross-sectional view showing a silicon-enriched interfaceregion on the second subset of vertical fins and substrate, and enlargedviews of the modified sacrificial layer and modified dummy dielectriclayer on the vertical fins, in accordance with an embodiment of thepresent invention.

In one or more embodiments, the heat treatment can form a modifiedinterfacial region 132 between the first sacrificial layer 130 and theadjoining substrate 110 and vertical fins 111. The modified interfacialregion 132 can be a region of decreased germanium concentration anddecreased interfacial trap concentration, where the modified interfacialregion 132 can alter the electrical properties of the channel regionformed by the vertical fins 111. The modified interfacial region 132 canhave an increased ratio of silicon to germanium due to the out-diffusionof the GeO, to create a modified interfacial region 132 of increasedsilicon concentration. The silicon-enriched interface region can be onthe second subset of vertical fins 111 and substrate 110, where thefirst sacrificial layer 130 was formed.

The modified interfacial region 132 can have a depth of less than 1 nm(<1 nm), where the modified interfacial region 132 can have a gradedchange in silicon and germanium concentration. The heat treatment canreduce the GeO₂ concentration of the first sacrificial layer 130 andsecond sacrificial layer 140 if present, while decreasing the germaniumconcentration to a range of less than about 5 at. % from an initialgermanium concentration of about 40 at. % or less. The heat treatmentcan form a dielectric layer 165, 167 with an increased thickness. Theheat treatment can increase the thickness of the second dummy dielectriclayer 160, where oxygen separates from the germanium dioxide (GeO₂) andforms GeO that leaves the first sacrificial layer 130, and oxygendiffuses to the interfacial region to react with germanium of thesubstrate 110 to form GeO. The volatile GeO can be eliminated from theSiGeO layers and SiGe substrate and SiGe vertical fins 111 to create themodified interfacial region 132 with decreased Ge concentration. Themodified interfacial region 132 can be a modified silicon surface havinga silicon concentration in the range of about 80 at. % to about 100 at.%, or about 80 at. % to about 90 at. % at the interface. The thicknessof the modified interfacial region 132 can be in the range of about 1monolayer to about 7 monolayers thick.

The heat treatment can form a combined dummy dielectric layer 165 fromthe first dummy dielectric layer 150 and second dummy dielectric layer160, and an enlarged dummy dielectric layer 167 from the firstsacrificial layer 130 and the second dummy dielectric layer 160 or thesecond sacrificial layer 140. The combined dummy dielectric layer 165and enlarged dummy dielectric layer 167 can be the same thickness afterheat treatment. The heat treatment can eliminate the GeO₂ from the firstsacrificial layer 130 and second sacrificial layer 140, and can form acondensed silicon (Si) layer 134 that is 100 at. % Si at the interface.The condensed Si layer 134 can be about 1 to about 7 monolayers, orabout 1 to about 3 monolayers thick.

The enlarged dummy dielectric layer 167 can have a thickness in therange of about 1 nm to about 4.5 nm. The combined dummy dielectric layer165 can have a thickness in the range of about 1 nm to about 4.5 nm.

FIG. 11 is a cross-sectional view showing a silicon-enriched interfaceregion on the second subset of vertical fins, gate structures on thevertical fins, and enlarged views of the layers on the vertical fins, inaccordance with an embodiment of the present invention.

In one or more embodiments, the fill layer 170 can be removed from thesubstrate 110 and vertical fins 111, where the fill layer 170 can beremoved using a selective etch (e.g., selective wet etch). Removal ofthe fill layer 170 can expose the underlying enlarged dummy dielectriclayer 167 and combined dummy dielectric layer 165. The enlarged dummydielectric layer 167 and combined dummy dielectric layer 165 can beremoved leaving a condensed silicon layer 134 and/or the modifiedinterfacial region 132.

A gate dielectric layer 180 can be formed on the condensed silicon layer134 and/or the modified interfacial region 132, where the gatedielectric layer can be a silicon oxide (SiO).

A high-K dielectric layer 190 can be formed on the gate dielectric layer180, where the high-K dielectric can be a material with a dielectricconstant greater than SiO₂. In an embodiments, the high-K dielectriclayer 190 can be hafnium oxide (HfO₂). The gate dielectric layer 180 andhigh-K dielectric layer 190 can be formed by conformal deposition. Thegate dielectric layer 180 can have a thickness in the range of about 0.5nm to about 1 nm. The high-K dielectric layer 190 can have a thicknessin the range of about 1.5 nm to about 2.5 nm.

A work function layer 200 can be formed on the high-K dielectric layer190. The work function layer 200 can be a conductive metal nitride or aconductive metal carbide. The work function layer 200 can have athickness in the range of about 4 nm to about 10 nm.

A gate fill 210 can be formed on the work function layer 200, where thegate fill 210 can be a conductive material or stack of conductivematerials. The conductive gate fill can be a metal conductor, and thework function layer and gate fill can form a conductive gate electrode.The gate fill 210 can be polished by CMP to provide a smooth, flatsurface exposing the work function layer 200 or high-K dielectric layer190. The gate electrode, high-K dielectric layer 190, and gatedielectric layer 180 can form a gate structure.

FIG. 12 is a cross-sectional view showing gate structures and topsource/drains on the vertical fins, in accordance with an embodiment ofthe present invention.

In various embodiments, the height of the gate structure can be reducedto provide for formation of a top spacer layer 220, where the top spacerlayer 220 can be blanket deposited and etched back. The top spacer layer200 can be an insulating dielectric material.

Top source/drains 230 can be formed on the vertical fins 111, and aninterlayer dielectric layer 240 can be formed over the top source/drainsand gate structures. Bottom source/drains 215 can be formed below one ormore of the vertical fins 111 to form vertical transport fin fieldeffect transistors (VT FinFETs).

FIG. 13 is a cross-sectional view showing a cover layer and asacrificial layer on a substrate, in accordance with an embodiment ofthe present invention.

In other embodiments, a planar type metal-oxide-semiconductor fieldeffect transistor can be fabricated by forming a first cover layer 120over a portion of the substrate 110, and forming a first sacrificiallayer 130 on the uncovered substrate 110.

FIG. 14 is a cross-sectional view showing a cover layer on the firstsacrificial layer and the substrate, and an exposed portion of the firstsacrificial layer, in accordance with an embodiment of the presentinvention.

A portion of the first sacrificial layer 130 can be covered by a secondcover layer 125, while leaving a portion of the first sacrificial layer130 exposed.

FIG. 15 is a cross-sectional view showing a second sacrificial layer onthe exposed portion of the first sacrificial layer, in accordance withan embodiment of the present invention.

A second sacrificial layer 140 can be formed on the exposed firstsacrificial layer 130. The second sacrificial layer 140 can be formed byCVD or PECVD.

FIG. 16 is a cross-sectional view showing an exposed portion of thesubstrate, in accordance with an embodiment of the present invention.

The first cover layer 120 can be removed to expose the previously maskedportion of the substrate 110. A third cover layer 128 can be formed onthe second sacrificial layer 140 adjoining the second cover layer 125,where the third cover layer 128 masks the first sacrificial layer 130and second sacrificial layer 140.

FIG. 17 is a cross-sectional view showing a first dummy dielectric layeron the substrate, and a cover layer on the first and second sacrificiallayers, in accordance with an embodiment of the present invention.

In one or more embodiments, a first dummy dielectric layer 150 can beformed on the substrate 110 exposed by removal of the first cover layer120. The first dummy dielectric layer 150 can be formed by atomic layerdeposition (ALD) or plasma enhanced atomic layer deposition (PEALD) toconformally cover the exposed substrate.

FIG. 18 is a cross-sectional view showing a fill layer on the dummydielectric layers and sacrificial layers, in accordance with anembodiment of the present invention.

The second cover layer 125 can be removed, and a second dummy dielectriclayer 160 can be formed on the first dummy dielectric layer 150 andfirst sacrificial layer 130. A fill layer 170 can be formed on thesecond dummy dielectric layer 160 and the second sacrificial layer 140,where the fill layer can form part of a dummy gate.

FIG. 19 is a cross-sectional view showing heat treatment of the filllayer, dummy dielectric layers and sacrificial layers, in accordancewith an embodiment of the present invention.

In various embodiments, portions of the fill layer 170, dummy dielectriclayers 150, 160, and sacrificial layers 130, 140 can be removed and anisolation region 230 can be formed between the separated fill layers170, dummy dielectric layers 150, 160, and sacrificial layers 130, 140.The isolation region 230 can be an electrically insulating materialformed in a trench in the substrate 110.

In one or more embodiments, a heat treatment can be used to react thesubstrate 110, sacrificial layers 130, 140, and dummy dielectric layers150, 160. The heat treatment can cause germanium (Ge) and oxygen (O) todiffuse between the layers to form germanium oxide (GeO) and silicon(Si), where the germanium oxide can diffuse away from the interfaceregions of the sacrificial layers 130, 140 with the substrate 110. Thefill layer 170, dummy dielectric layers 150, 160, and sacrificial layers130, 140 can be on channel regions 118 in the substrate 110, where thechannel regions can form part of a MOSFET.

In various embodiments, the heat treatment can be at a temperature inthe range of about 850° C. to about 1250° C., or in the range of about1000° C. to about 1100° C., or in the range of about 1050° C. to about1200° C. The heat treatment can be conducted for a period of about 1second to about 60 seconds, where the heat treatment can be a flashanneal, a rapid thermal anneal (RTA), or a furnace anneal.

FIG. 20 is a cross-sectional view showing gate structures on channelregions in the substrate, and enlarged views of the layers on thechannel regions, in accordance with an embodiment of the presentinvention.

In one or more embodiments, the heat treatment can form a modifiedinterfacial region 132 between the first sacrificial layer 130 and theadjoining substrate 110. The modified interfacial region 132 can be aregion of decreased germanium concentration and decreased interfacialtrap concentration. The modified interfacial region 132 can have a depthof less than 1 nm (<1 nm), where the modified interfacial region 132 canhave a graded silicon and germanium concentrations. The heat treatmentcan reduce the thickness of the first sacrificial layer 130, whiledecreasing the germanium concentration to a range of about 5 at. % toabout 40 at. % depending on the initial germanium concentration. Removalof the Ge can form a condensed Si layer 134 having 100 at. % Si.

The heat treatment can also increase the thickness of the second dummydielectric layer 160, where oxygen from the germanium dioxide (GeO₂)forms GeO that leaves the first sacrificial layer 130 and forms SiO₂that increase the thickness of the second dummy dielectric layer.

The heat treatment can form a combined dummy dielectric layer 165 fromthe first dummy dielectric layer 150 and second dummy dielectric layer160, and an enlarged dummy dielectric layer 167 from the firstsacrificial layer 130 and second dummy dielectric layer 160 or secondsacrificial layer 140.

The enlarged dummy dielectric layer 167 can have a thickness in therange of about 1 nm to about 4.5 nm. The combined dummy dielectric layer165 can have a thickness in the range of about 1 nm to about 4.5 nm.

In various embodiments, gate spacers 250 can be formed on a fill layer170, dummy dielectric layers 150, 160, and sacrificial layers 130, 140to form a dummy gate structure. The dummy gate structure can be removedand an active gate structure formed. The enlarged dummy dielectric layer167 and combined dummy dielectric layer 165 can be removed leaving acondensed silicon layer 134 and/or the modified interfacial region 132.The active gate structure including a gate dielectric layer 180, high-Kdielectric layer 190, a work function layer 200, and a gate fill 210,which can be formed on the condensed silicon layer 134 and/or themodified interfacial region 132. Source/drains 260 can be formed in thesubstrate 110 by doping or implantation. The channel regions can bebetween the source/drains 260 and below the active gate structure.

FIG. 21 is an X-ray photoelectron spectroscopy plot for germaniumshowing the change in chemical composition and environment by heattreatment, in accordance with an embodiment of the present invention.

The spectrum shows the elimination of the Ge—O band after the annealindicating elimination of the GeO from SiGeO sacrificial layers 130,140.

FIG. 22 is an X-ray photoelectron spectroscopy plot for silicon showingthe change in chemical composition and environment by heat treatment, inaccordance with an embodiment of the present invention.

The spectrum shows no change in the Si—Si band and an increase in theSi—O band indicting an increase in SiO₂ for enlarged dummy dielectriclayer 167.

FIG. 23 is an X-ray photoelectron spectroscopy plot for germaniumshowing the change in chemical composition and environment by heattreatment, in accordance with an embodiment of the present invention.

The spectrum shows no presence or change in the Ge—O band for germaniumoxide (GeO) in the SiO₂ dummy dielectric layers 150, 160.

FIG. 24 is an X-ray photoelectron spectroscopy plot for silicon showingthe change in chemical composition and environment by heat treatment, inaccordance with an embodiment of the present invention.

The spectrum shows no change in the Si—Si band or Si—O band in the SiO₂dummy dielectric layers 150, 160.

FIG. 25 is a block/flow diagram of a fabrication process for formingmodified channel interfaces, in accordance with an embodiment of thepresent invention.

Block 510 shows the formation of a dummy gate layer on the channelregion of a substrate. The dummy gate layer can include one or moresacrificial layers, one or more dummy dielectric layers, or acombination of a sacrificial layer and a dummy dielectric layer.

Block 515 shows the configuration of the dummy gate layers. Thesacrificial layers can be SiGeO, and the dummy dielectric layers can beSiO₂. The sacrificial layers can be formed by CVD, PECVD, or acombination thereof. The dummy dielectric layers can be formed by ALD,PEALD, or a combination thereof. The dummy gate layer can be acombination of an SiGeO layer and a SiO₂ layer, two SiGeO layers, or twoSiO₂ layers.

Block 520 shows the formation of a dummy gate structure on the dummygate layer. The dummy gate structure can include a fill layer that canbe later removed and replaced with an active gate structure includinggate dielectric layers, a work function layer, and a conductive gatefill.

Block 530 shows the heat treatment of the dummy gate layer and dummygate structure to form an interfacial region with reduced defects andtraps, where the interfacial region is between the channel region and agate structure.

Block 535 shows the heat treatment can be conducted at a temperature ofabout 1050° C. to about 1200° C.

Block 537 shows the heat treatment can cause oxygen to migrate from GeO₂to GeO to reduce the Ge concentration at the interfacial region.

Block 540 shows the formation of source/drains and a gate structure onthe channel region to form VT FinFETs or MOSFETs with varying thresholdvoltages based on the amount of germanium removed from the interfacialregion, where an unmodified interface has a reference threshold voltage,a partially modified interface has an intermediate threshold voltageshift from the reference threshold voltage, and the highly modifiedinterface has a large threshold voltage shift from the referencethreshold voltage. A large threshold voltage shift can be in the rangeof about 100 mV to about 200 mV from the reference threshold voltage. Anintermediate threshold voltage shift can be in the range of about 60 mVto about 100 mV from the reference threshold voltage.

The metal gate thicknesses can be consistent between the devices withunmodified interfaces, partially modified interfaces, and highlymodified interfaces because the dummy gate layers can be removed toleave the exposed modified interface, and an active gate structure isformed for all three devices at the same time to avoid gate dielectricand work function thickness variations.

Having described preferred embodiments of the fabrication of fieldeffect transistors with different threshold voltages through modifiedchannel interfaces (which are intended to be illustrative and notlimiting), it is noted that modifications and variations can be made bypersons skilled in the art in light of the above teachings. It istherefore to be understood that changes may be made in the particularembodiments disclosed which are within the scope of the invention asoutlined by the appended claims. Having thus described aspects of theinvention, with the details and particularity required by the patentlaws, what is claimed and desired protected by Letters Patent is setforth in the appended claims.

What is claimed is:
 1. A method of fabricating a plurality of fieldeffect transistors with different threshold voltages, comprising:forming a first dummy dielectric layer and a second dummy dielectriclayer on a first channel region; forming a first sacrificial layer and asecond sacrificial layer on a second channel region; forming the firstsacrificial layer and the second dummy dielectric layer on a thirdchannel region; and performing a heat treatment that causes a reactionbetween a substrate, the first and second sacrificial layers, and thefirst and second dummy dielectric layers to form a modified interfacialregion between the first sacrificial layer and the adjoining substrate.2. The method of claim 1, wherein the modified interfacial region has adecreased interfacial trap concentration compared to before the heattreatment.
 3. The method of claim 2, wherein the modified interfacialregion has a thickness of less than 1 nm.
 4. The method of claim 1,wherein the heat treatment forms an enlarged dummy dielectric layer fromthe first sacrificial layer and the second dummy dielectric layer, and acombined dummy dielectric layer from the first dummy dielectric layerand second dummy dielectric layer.
 5. The method of claim 4, furthercomprising removing the enlarged dummy dielectric layer and combineddummy dielectric layer.
 6. The method of claim 5, further comprisingforming a gate dielectric layer on the modified interfacial region. 7.The method of claim 6, further comprising forming a high-K dielectriclayer on the gate dielectric layer.
 8. The method of claim 7, whereinthe heat treatment is conducted at a temperature in the range of about850° C. to about 1250° C.
 9. The method of claim 7, wherein the heattreatment is conducted for a period of about 1 second to about 60seconds.
 10. A method of fabricating a plurality of field effecttransistors with different threshold voltages, comprising: forming afirst dummy dielectric layer and a second dummy dielectric layer on afirst channel region, wherein the first dummy dielectric layer andsecond dummy dielectric layer are silicon dioxide (SiO₂); forming afirst sacrificial layer and a second sacrificial layer on a secondchannel region, wherein the first sacrificial layer is silicon-germaniumoxide (SiGeO) and the second sacrificial layer is silicon-germaniumoxide (SiGeO); forming the first sacrificial layer and the second dummydielectric layer on a third channel region; and performing a heattreatment that causes a reaction between a substrate, the first andsecond sacrificial layers, and the first and second dummy dielectriclayers to form a modified interfacial region between the firstsacrificial layer and the adjoining substrate.
 11. The method of claim10, wherein the first sacrificial layer and second sacrificial layerhave a combined thickness in the range of about 4 nm to about 5 nm. 12.The method of claim 10, wherein the modified interfacial region has adecreased germanium concentration.
 13. The method of claim 10, whereinthe heat treatment increases the thickness of the second dummydielectric layer.
 14. The method of claim 10, wherein the heat treatmentcauses germanium (Ge) and oxygen (O) to diffuse between the layers toform silicon dioxide (SiO₂) and germanium oxide (GeO), wherein thevolatile germanium oxide (GeO) diffuses away from an interface region ofthe sacrificial layers with the substrate to form the modifiedinterfacial region.
 15. The method of claim 14, wherein the modifiedinterfacial region has a thickness of less than 1 nm between the firstsacrificial layer and the second channel region.
 16. A method offabricating a plurality of field effect transistors with differentthreshold voltages, comprising: forming a first dummy dielectric layerand a second dummy dielectric layer on a first channel region, whereinthe first dummy dielectric layer and second dummy dielectric layer aresilicon dioxide (SiO₂); forming a first sacrificial layer and a secondsacrificial layer on a second channel region, wherein the firstsacrificial layer is silicon-germanium oxide (SiGeO) and the secondsacrificial layer is silicon-germanium oxide (SiGeO); forming the firstsacrificial layer and the second dummy dielectric layer on a thirdchannel region; and performing a heat treatment that causes a reactionbetween a substrate, the first and second sacrificial layers, and thefirst and second dummy dielectric layers to form a modified interfacialregion between the first sacrificial layer and the adjoining substrate,an enlarged dummy dielectric layer from the first sacrificial layer andthe second dummy dielectric layer, and a combined dummy dielectric layerfrom the first dummy dielectric layer and second dummy dielectric layer.17. The method of claim 16, wherein the modified interfacial region hasa thickness of less than 1 nm.
 18. The method of claim 16, furthercomprising removing the enlarged dummy dielectric layer and combineddummy dielectric layer to leave a condensed silicon layer.
 19. Themethod of claim 18, further comprising forming a gate dielectric layeron the condensed silicon layer and modified interfacial region.
 20. Themethod of claim 19, further comprising forming a high-K dielectric layeron the gate dielectric layer, wherein the gate dielectric layer is SiO₂and the high-K dielectric layer is hafnium oxide.